Collaborative Funded Projects

Soitec in European funding programs

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The participation of Soitec in IPCEI and European funding projects

 

Since the 2010s, European funding programs have evolved from Horizon 2020 to CHIPS JU through IPCEI contracts. These programs support innovation projects and cover all Technology Readiness Levels (TRL) up to industrial deployment. Soitec mainly addresses CHIPS JU calls and is a direct partner of IPCEI.

 

Key Benefits of Participation : 

  • Encourages collaboration and partnerships

  • Requires forming Consortiums with partners across the value chain

  • Accelerates innovation and industry responsiveness

  • Strengthens European semiconductor ecosystems

  • Increases European competitiveness in the global market

 

 

Projects in which Soitec is participating

 

Soitec participates in 2 Work Streams Think, Act and leads the Work Stream Communicate:

  • THINK addresses processors and memory as the brain of a computer. Soitec activity in this Work Stream is the development of the FDSOI and 2.5D3D.

  • ACT addresses the body and muscles of an electronic system. For Soitec, this Work Stream merges all the activity on SmartSiC for Power Electronics.

  • COMMUNICATE is the most important in terms of technologies for Soitec. It addresses the strong nerve pathways which network with the brain : POI, RFSOI, GaN, InP, Photonics,etc.

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France 2030Republique FrancaiseL Europe S Engage en Region

The project offers the first European industrial roadmaps for adding connectivity and functionality features on existing CMOS technology. It will bring together significant European actors from the entire value chain, from materials and semiconductor technologies to the systems, to build a complete European supply chain for RF electronics, enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. Ultimately, the project will allow a high-scale integration for reduced consumption of power and costs, leading to the production of reliable and environmentally friendly components.

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Chips JU European Comission

The project offers the first European industrial roadmaps for adding connectivity and functionality features on existing CMOS technology. It will bring together significant European actors from the entire value chain, from materials and semiconductor technologies to the systems, to build a complete European supply chain for RF electronics, enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. Ultimately, the project will allow a high-scale integration for reduced consumption of power and costs, leading to the production of reliable and environmentally friendly components.

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Chips JUEuropean Comission

The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition. It will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.

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Chips JU European Comission

 

Soitec participates in 2 Work Streams Think, Act and leads the Work Stream Communicate:

  • THINK addresses processors and memory as the brain of a computer. Soitec activity in this Work Stream is the development of the FDSOI and 2.5D3D.

  • ACT addresses the body and muscles of an electronic system. For Soitec, this Work Stream merges all the activity on SmartSiC for Power Electronics.

  • COMMUNICATE is the most important in terms of technologies for Soitec. It addresses the strong nerve pathways which network with the brain : POI, RFSOI, GaN, InP, Photonics,etc.

Learn More

 

France 2030Republique FrancaiseL Europe S Engage en Region

Soitec is one of the 26 partners of this project coordinated by Valeo. FASTLANE targets a complete, highly competitive, and sustainable European value chain for Silicon Carbide (SiC) based power electronics. The goal is to provide cutting-edge technology excellence from engineered SiC substrates to innovative, novel devices, smart power modules and converters/inverters for a wide range of automotive and industrial applications.

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Chips JU European Comission

OCEAN12: A collective initiative to advance FD-SOI Technology

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