Soitec in European funding programs
Since the 2010s, European funding programs have evolved from Horizon 2020 to CHIPS JU through IPCEI contracts. These programs support innovation projects and cover all Technology Readiness Levels (TRL) up to industrial deployment. Soitec mainly addresses CHIPS JU calls and is a direct partner of IPCEI.
Key Benefits of Participation :
Encourages collaboration and partnerships
Requires forming Consortiums with partners across the value chain
Accelerates innovation and industry responsiveness
Strengthens European semiconductor ecosystems
Increases European competitiveness in the global market
Soitec participates in 2 Work Streams Think, Act and leads the Work Stream Communicate:
The project offers the first European industrial roadmaps for adding connectivity and functionality features on existing CMOS technology. It will bring together significant European actors from the entire value chain, from materials and semiconductor technologies to the systems, to build a complete European supply chain for RF electronics, enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. Ultimately, the project will allow a high-scale integration for reduced consumption of power and costs, leading to the production of reliable and environmentally friendly components.
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The project offers the first European industrial roadmaps for adding connectivity and functionality features on existing CMOS technology. It will bring together significant European actors from the entire value chain, from materials and semiconductor technologies to the systems, to build a complete European supply chain for RF electronics, enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. Ultimately, the project will allow a high-scale integration for reduced consumption of power and costs, leading to the production of reliable and environmentally friendly components.
The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition. It will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe.
Soitec participates in 2 Work Streams Think, Act and leads the Work Stream Communicate:
Soitec is one of the 26 partners of this project coordinated by Valeo. FASTLANE targets a complete, highly competitive, and sustainable European value chain for Silicon Carbide (SiC) based power electronics. The goal is to provide cutting-edge technology excellence from engineered SiC substrates to innovative, novel devices, smart power modules and converters/inverters for a wide range of automotive and industrial applications.
Soitec's technological innovation is focused on providing engineered substrates and advanced materials solutions that will drive the future of energy-efficient electronics
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