BEYOND5
Building the fully European supply chain on RFSOI, enabling New RF Domains for sensing, Communication, 5G and beyond
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What is it ?
The European BEYOND5 project, dedicated to structure a European value chain around SOI for 5G, ADAS sensors and other RF applications and coordinated by Soitec, came to an end in December 2024.
Funded by the CHIPS Joint Undertaking, it ran from June 2020 to December 2024 bringing together 37 partners from 10 countries. The project's final review took place on May 6th and 7th 2025 at the Lund University in Sweden, with an ambitious demonstrators’ showcase.
The BEYOND5 results are spread over 4 levels of the value chain :
Innovative 300mm SOI substrates for RF application with improved linearity performance and cost of ownership,
Advanced RFSOI and 22FDX-RF technologies enabling Multi Project Wafers access,
Development of innovative design for integrated circuits,
Six applicative demonstrators based on RF-SOI and FDSOI-RF technologies addressing the fields of IoT for Asset Tracking, contactless USB, V2X for autonomous connected trucks in a construction site, 5G low power consumption base station for dense spaces and aircrafts, intelligent automotive radars and mm-Wave in cabin sensors opening multiple opportunities in gesture recognition, security, health monitoring.
“In the scope of the Beyond5-Project, Indie develop and realize a radar based “Life Signe and Gesture Detector” based on a 4 × 4 MIMO TRX 22FDX chip with integrated antennas in packaging (GF 22nm FD-SOI technology) at 116 – 123 GHz including “Human Target Recognition” / “Vital Signal Detection” and “3D Scene visualization / GUI”.
The new sensor could be installed into passenger vehicles, trucks, or other transportation systems, as it could support vital-sign detection (heartbeat, respiration) of the driver and of other passengers and it could support baby-left-alarm functionality, detection of out-of-position situations and detection of possible obstacles. Thus, a significant market potential would be expected.”
Dr. Wojciech Debski, CTO of Indie Semiconductor FFO GmbH.
In a constantly evolving world of communications (5G, 6G, THz, etc.), the BEYOND5 project has enabled Soitec to develop and improve its SOI substrates to meet tomorrow's technological challenges.
Beyond this project SOITEC continues collaborative CHIPS JU initiatives on smart substrates providing increased competitiveness and sustainability in the connectivity fields. In particular, the Move2THz and HiPower5.0 projects bring together dedicated ecosystems on the topics of InP for THz and GaN for power applications.
“By coordinating BEYOND5 around a complete RFSOI value chain, Soitec confirms its commitment to structuring innovative European ecosystems. We're proud of our ecosystem, structured through our projects. Our active participation in CHIPS JU programs strengthens our ability to innovate in advanced substrates, while contributing to Europe's ambitions for technological sovereignty.”
Pierre Barnabé, CEO of SOITEC
Thanks to funding authorities
The project BEYOND5 has received funding from CHIPS JU under grant agreement No 876124.
These insights help drive the development of innovative projects financed by the French state within the framework of France 2030 :
- The project Move2THz has received funding from CHIPS JU under grant agreement No 101139842.
- The project HiPower5.0 has received funding from CHIPS JU under grant agreement No 101194246.
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