Smart Stacking™ Technology
A patented technology enabling the transfer of ultra-thin layers from etched or partially etched CMOS wafers to other materials.
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Layer Transfer Technology
This transfer is carried out by direct bonding of the plate at low temperature and by mechanical-chemical thinning.
With extensive expertise in layer transfer, Soitec tailors solutions to customer needs: Smart Stacking™ technology adapts to plates from 150 mm to 300 mm in diameter.
It is also compatible with a wide variety of substrates including silicon, glass, ceramic (polycrystalline AlN), fused silica, and sapphire.
How Smart Stacking™ Works
Smart Stacking™ transfers thin layers of wafers to other substrates in a high-performance industrial environment, following these key steps:
Surface conditioning
Low-temperature molecular bonding
Wafer thinning
Edge treatment
Cleaning and metrology
This process is backed by more than 20 years of experience and a strong global patent portfolio.
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