Beyond Silicon Technology
Soitec is diversifying beyond silicon technologies by exploring and advancing new material solutions, such as compound semiconductors and smart substrates, to enable advances in fields such as mobile communication, automotive and AI
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Thanks to the patented Smart Cut™ technology, Soitec designs substrates that are specifically tailored to meet customer expectations.
For instance, a thin crystalline material layer can be transferred from a piezoelectric donor substrate (LTO, LNO), Silicon Carbide (SiC), Gallium Nitride (GaN or InGaN), or Indium Phosphide (InP) to another substrate, enabling the production of high-value plates at a competitive cost.
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