RF-SOI substrates

SOI stands for Silicon on Insulator and refers to the use of a layered silicon-insulator-silicon substrate on which semiconductor devices are manufactured. Soitec manufactures SOI substrates using premium raw silicon wafers and insulating materials. Thanks to Soitec SOI substrates semiconductor devices lower parasitic capacitance considerably improving electrical performance significantly.

RF-SOI stands for Radio Frequency Silicon on Insulator and refers to SOI that has been optimized for RF applications. Soitec RF-SOI family of products consist of SOI substrates each one with specific enhancements to address broad applications smartphones, automotive connectivity and IoT and protocols such as cellular 5G and 5G-Advanced, Wi-Fi, Bluetooth and many others. RF CMOS semiconductor devices built on Soitec RF-SOI substrates exhibit cost-effective lower power consumption, higher linearity, higher frequency operation and smaller footprint compared to those built on bulk silicon wafers.

RFeSITM stands for RF enhanced Signal Integrity and is the industry-leading SOI substrate for RF applications. Soitec’s RFeSITM substrates have four distinctive layers: A high quality top silicon on which RF semiconductor devices are manufactured, a buried oxide serving as insulator to minimize parasitic capacitances, a signature Trap Rich layer ensuring high RF performance for the most demanding RF applications and a high resistivity silicon layer improving RF signal propagation efficiency.

HR-SOI stands for High-Resistivity Silicon-on-Insulator and refers to a specialized SOI substrate where the bottom silicon layer has a significantly higher resistivity to improve RF signal propagation efficiency compared to standard SOI substrates. Soitec HR-SOI substrates respond to the needs of connected objects that can trade RF performance for cost-effective, reliable and robust connectivity.

Soitec RF-SOI substrates are embedded in 100% of 5G smartphones and selected Wi-Fi, Bluetooth and 802.15.4 enabled connected devices. Soitec’s RF-SOI substrates also provide substantial benefits to wireless network infrastructure, satellite and automotive applications where top reliable RF performance and energy-efficiency with compact footprint are a must.

Married to foundries RF CMOS processes, Soitec RF-SOI substrates provide cost-effective high integration capabilities enabling the high potential of digital/logic, analog/mixed-and RF signal coexistence in the same integrated circuit. Thanks to its intrinsic characteristics, Soitec’s RF-SOI helps minimize losses and interferences for a highly energy-efficient RF circuit and system. Furthermore, Soitec’s RF-SOI products are designed to provide the same level of functionality at all the most common frequency bands used in commercial and professional markets.