Products

Soitec’s Radio Frequency Silicon-on-Insulator (RF-SOI) substrate technology powers smartphones and other wireless devices with high-performance RF Front-End modules, enabling efficient, robust, and reliable 5G and Wi-Fi connectivity

Although Moore’s law is slowing down, Soitec’s Fully Depleted Silicon-on-Insulator (FD-SOI) engineered substrates offer differentiating solutions that exceed the requirements of major industry trends.

Soitec’s Piezoelectric-on-Insulator (POI) engineered substrates address the growing demand for high-performance and increasingly complex 5G radiofrequency filters in smartphones and other devices.

Soitec’s RF Gallium Nitride (GaN) technology is driving innovation in power amplifiers for 5G infrastructure base stations and smartphones.

Soitec’s Auto Power-SOI product line meets the need to integrate high- and low-voltage functions into intelligent and sustainable power IC devices for automotive and industrial markets.

Soitec’s SmartSiC™ Silicon Carbide (SiC) technology sets a new standard in power electronics, supporting the electrification, autonomy, sustainability, power efficiency, and cost optimization of electric vehicles and industrial applications

Soitec’s FD-SOI technology is ideal for automotive radar and processors. It combines the performance of advanced RF technologies with the energy efficiency of cutting-edge CMOS technologies, offering an optimal platform for SOC integration.

Soitec’s Smart Cut™ Silicon-on-Insulator (SOI) technology, dedicated to photonics and optical networks, provides breakthrough solutions for achieving high data rates at optimized costs across a wide range of datacom applications.

Imager SOI product line enhances the pixel performance in Near Infrared (NIR) sensors and helps improve the performance, functionalities, and cost profile of augmented reality (AR), virtual reality (VR), and facial-recognition security systems and applications.

PD-SOI product line enables customers to improve, increase and integrate a growing range of High-Performance Computing (HPC) capabilities and functionalities in servers, Artificial Intelligence (AI) and Internet of Things (IoT) infrastructures, as well as advanced Enterprise Resource Planning (ERP) hardware in multiple architectures.

With Moore's law slowing down, FD-SOI engineered substrates can bring differentiating solutions that exceed megatrends requirement.

MEMS-SOI substrates enable precise, reliable MEMS fabrication by combining a silicon device layer, an insulating oxide layer, and a supporting handle layer.