Connect POI substrates

SAW-ladder— and impedance element filters —, built from series and parallel resonators, take full advantage of POI substrates, where maximized Q factors and ideal coupling deliver steep filter skirts and ultra- low insertion loss. These architectures are well suited to handle maximum incident power. With the Connect POI product, thermal compensation comes from the substrate, there’s no need for an additional deposited layer. Moreover the whole POI structure fosters heat dissipation, responding to the Power Class 1.5 requirements. And no issue with the 50 ohms matching.

Connect POI empowers DMS, Double Mode SAW, and innovative architectures, as it offers extremely low Insertion Loss and out-of-band attenuation options. Demanding specifications of Rx filters can be reached, responding to Adjacent Channel Rejection and Adjacent Channel Selectivity requirements. Advantages listed for the Tx filters are also applicable for the Rx filters

Duplexer can be designed by combining the both previous approaches of Rx and Tx filters on POI. The Connect POI versatility enables also to integrate, on a same die, some filters addressing different frequencies: diplexer and multiplexer can be then integrated on a single chip, with a single IDT metal layer. Reached cross-isolation or isolation across bands is sufficient between the aggregate paths.

The compatibility with multiple IDT technology variants, and advanced package technologies, makes the Connect POI MultiLayer RF Filter easy to produce and integrate. Just a few litho-masks are needed for this process. The Si handle robustness enables the application of advanced packaging technologies, such as fine WLCSP, flip-chip, followed by module assembly, and System In Packages for RFFE modules. One advantage stands in the achievable yields, much better than with TC-SAW technology, particularly for multi-frequency devices.

The POI multilayers stack offers better waveguide performances, boosting the piezoelectric properties, and limiting its thermoelastic variations. All, on a robust mechanical substrate ! Moreover a substrate stack can be designed to optimize performance across various frequency bands, enabling efficient multiplexing !

Connect POI is capable of addressing the whole spectrum, including LTE, 5G, and beyond, enabling energy efficient RF filter designs with compact footprint. Which leads to address multiple markets : Mobile Market,IoT Market,Non Terrestrial Network and SATCOM.