Patents

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Connect POI Patents

Soitec POI substrates are covered by one or more of the following patents:

US8765571

US10270413

USRE49365

US9953855

US10250282

US10910250

US11742233

US10276492

US9824915

US10826459

US11595020

US11637542

US10943778

US11837463

US11335847

US10608610

US10924081

US11711065

US11652464

US11349065

US11930710

US11600766

US11101428

US11398595

US11744154

US10943815

US11367650

US11923239

US11744153

US11251265

US11800803

US11159140

US11462676

US11373856

US11742817

US11309399

US11870411

US11688627

US11974505

US11979132

US11501997

US2024/0021461

US2023/0275559

US2024/0014027

US2022/0158080

US2023/0378931

US2023/0253949

US2018/316329

US2024/0147864

US2023/0217832

US2021/367139

US2023/0363279

US2024/0040930

US2020/336127

US2022/301847

US2023/0353115

US2022/285520

US2021/020826

US2024/0146275

US2021/0407849

US2024/0030883

US2023/0291377

US2024/0072753

US2022/359272

US2023/005787

US2022/247374

US2022/399200

US2024/0178056

US2023/0230874

US2024/0120191

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Soitec designs and manufactures highly advanced semiconductor materials and play a key role in the microelectronics industry

 

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Explore how Soitec pioneers cutting-edge technologies to shape the future of semiconductor innovation.

POI

Tailored multilayers piezoelectric substrates that create high performance RF filters, with best-in-class uniform thin films, thanks to the Smart Cut™ technology.

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