Innovation

Soitec's technological innovation is focused on providing engineered substrates and advanced materials solutions that will drive the future of energy-efficient electronics

Soitec Bernin Fab

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Soitec was born from a major innovation:

Smart Cut™ technology

Developed in collaboration with CEA-Leti (one of the world's leading microelectronics research laboratories), Smart Cut™ technology can be compared to an “atomic scalpel”: it makes it possible to transfer a very thin layer of material from a substrate to another.

Thanks to it, it became possible to produce stacks of extremely thin (10 to 100 nm) and perfectly uniform single crystal layers of semiconductors, which could not be obtained with conventional microelectronics technologies.

By assembling thin layers on the same substrate, Smart Cut™ technology makes it possible to design microelectronic equipment combining performance and energy efficiency and thus contributes to reducing their environmental footprint.

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2025 Key figures

+4300

active patents

 

531

patents filled in 2024

17,1%

of revenue invested in R&D

Soitec Innovation

Innovation is in our DNA

By using and perfecting Smart Cut™ technology, we have industrialized the production of silicon-on-insulator (SOI), a material used by our customers to manufacture higher-performance, more energy-efficient electronic components. We have also extended the use of Smart Cut™ technology to materials other than silicon, developed other layer transfer processes (Smart Stacking) and developed other expertise (epitaxy).

Today, we are the world leader in specialized substrates such as silicon on insulator (SOI), piezoelectric on insulator (POI), silicon carbide (SiC) and gallium nitride (GaN). Having become a world leader in the production of SOI, specialized substrates and industrial thin layer transfer technologies, we invest on average 10% of our annual turnover in R&D and have a portfolio of more than 4,000 patents.

Discover Our Ecosystem

Patents and inventors at Soitec

With over 4,300 active patents filed worldwide, Soitec’s innovation strategy is firmly anchored in groundbreaking solutions that drive differentiation and meet the evolving needs of its clients. Patents are not only a hallmark of Soitec’s history—starting with the invention of its revolutionary Smart Cut™ process—but they remain a pillar of the company’s success and strategic growth. 

More than 300 inventors actively contribute to the development and protection of innovation through patent applications. In 2024-2025, 94 inventors contributed to new patent filings. This dynamic reflects a corporate culture that values creativity and collaboration. From maintenance technicians solving an operational issue to marketing experts identifying a differentiating technical feature, every idea contributes to maintaining Soitec’s leadership in innovation. 

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Our innovation drivers, PPACt

Pierre-Barnabe

P for Performance

  • Speed
  • Linearity
  • Defectivity
Soitec PowerGaN

P for Power

  • Lower power consumption
  • Energy efficiency
Soitec PD-SOI

AC for Area-Cost

  • Smaller die size
  • Integrated chips, functions
  • Yield
  • Die cost

t for Time-To-Market

  • Adoption window
  • Faster than competition


greenovation

Sustainability

  • Energy efficient products
  • Environment footprint

Greenovation

The eco-design approach, also called Greenovation, integrates sustainable development criteria at the heart of our decision-making processes for all our product developments. Its objective is to systematically include the environmental dimension as a selection criterion at each stage of design.

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Commitments

To contribute to a more sustainable future, we have placed environmental, social and governance issues at the heart of our strategy

 

People

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