Polishing & Reclaim Services
NOVASiC: Expert in reclaiming & wafering services for high-quality, wide-bandgap materials.
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NOVASiC reclaim & wafering services, tailored for your needs
With over 25 years of experience, NOVASiC delivers specialized wafering and reclaim services for wide-bandgap semiconductor wafers.
This comprehensive offering enables NOVASiC to support diverse projects, from industrial-scale applications to precise, small-scale research initiatives.
How NOVASiC will impact your business
Reclaim services
Allows prime, monitor and scrapped wafers to be returned to a process-ready state. This reduces costs as well as environmental impact.
Wafering services
NOVASiC offers polishing, planarization and thinning services for a range of wide-bandgap semi-conductor wafers.
How NOVASiC helps you
NOVASiC’s tailored SiC reclaim process
- 50 - 200mm wafers
- SiC or GaN epi / SiC
- N-type, P-type & semi-insulating SiC substrates
- Ultra-precise StepSiC polishing (0,1 nm RMS)
- Standard thickness removal: 0 - 30 µm
- Custom thickness removal: > 30 µm
NOVASiC's diverse wafering services
- NOVASiC has over 25 years of experience in wafering services for semiconductor wafers, working hand-in-hand with clients to serve their specific needs.
Frequently asked questions
How many times can we reclaim the same wafer?
Up to 10 times
What thickness is removed in addition to the epitaxial layer?
A minimum of 10µm is removed in addition to the epitaxial layer, in function of the initial epitaxy thickness and the quality of the thickness reporting.
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