Polishing & Reclaim Services
NOVASiC: Expert in reclaiming & wafering services for high-quality, wide-bandgap materials.
Talk with an expert
NOVASiC reclaim & wafering services, tailored for your needs
With over 25 years of experience, NOVASiC delivers specialized wafering and reclaim services for wide-bandgap semiconductor wafers.
This comprehensive offering enables NOVASiC to support diverse projects, from industrial-scale applications to precise, small-scale research initiatives.
How NOVASiC will impact your business
Reclaim services
Wafering services
How NOVASiC helps you
NOVASiC’s tailored SiC reclaim process
- 50 - 200mm wafers
- SiC or GaN epi / SiC
- N-type, P-type & semi-insulating SiC substrates
- Ultra-precise StepSiC polishing (0,1 nm RMS)
- Standard thickness removal: 0 - 30 µm
- Custom thickness removal: > 30 µm
NOVASiC's diverse wafering services
- NOVASiC has over 25 years of experience in wafering services for semiconductor wafers, working hand-in-hand with clients to serve their specific needs.
Frequently asked questions
Up to 10 times
A minimum of 10µm is removed in addition to the epitaxial layer, in function of the initial epitaxy thickness and the quality of the thickness reporting.
Related Events
IEDM 2025
Substrate Vision Summit 2025
Engineering the Future – Soitec Substrates Powering Technology Megatrends
Related Content
Semiconductor Fabs
Commitments
To contribute to a more sustainable future, we have placed environmental, social and governance issues at the heart of our strategy.
Innovation
