Polishing & Reclaim Services
NOVASiC: Expert in reclaiming & wafering services for high-quality, wide-bandgap materials.
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NOVASiC reclaim & wafering services, tailored for your needs
With over 25 years of experience, NOVASiC delivers specialized wafering and reclaim services for wide-bandgap semiconductor wafers.
This comprehensive offering enables NOVASiC to support diverse projects, from industrial-scale applications to precise, small-scale research initiatives.
How NOVASiC will impact your business
Reclaim services
Wafering services
How NOVASiC helps you
NOVASiC’s tailored SiC reclaim process
- 50 - 200mm wafers
- SiC or GaN epi / SiC
- N-type, P-type & semi-insulating SiC substrates
- Ultra-precise StepSiC polishing (0,1 nm RMS)
- Standard thickness removal: 0 - 30 µm
- Custom thickness removal: > 30 µm
NOVASiC's diverse wafering services
- NOVASiC has over 25 years of experience in wafering services for semiconductor wafers, working hand-in-hand with clients to serve their specific needs.
Frequently asked questions
Up to 10 times
A minimum of 10µm is removed in addition to the epitaxial layer, in function of the initial epitaxy thickness and the quality of the thickness reporting.
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