Polishing & Reclaim Services

NOVASiC: Expert in reclaiming & wafering services for high-quality, wide-bandgap materials.

Soitec NovaSiC

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NOVASiC reclaim & wafering services, tailored for your needs

With over 25 years of experience, NOVASiC delivers specialized wafering and reclaim services for wide-bandgap semiconductor wafers.

This comprehensive offering enables NOVASiC to support diverse projects, from industrial-scale applications to precise, small-scale research initiatives.


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How NOVASiC will impact your business

Reclaim services

Allows prime, monitor and scrapped wafers to be returned to a process-ready state. This reduces costs as well as environmental impact.

Wafering services

NOVASiC offers polishing, planarization and thinning services for a range of wide-bandgap semi-conductor wafers.

How NOVASiC helps you

NOVASiC’s tailored SiC reclaim process

  • 50 - 200mm wafers
  • SiC or GaN epi / SiC
  • N-type, P-type & semi-insulating SiC substrates
  • Ultra-precise StepSiC polishing (0,1 nm RMS)
  • Standard thickness removal: 0 - 30 µm
  • Custom thickness removal: > 30 µm

NOVASiC's diverse wafering services

  • NOVASiC has over 25 years of experience in wafering services for semiconductor wafers, working hand-in-hand with clients to serve their specific needs.

Frequently asked questions

A minimum of 10µm is removed in addition to the epitaxial layer, in function of the initial epitaxy thickness and the quality of the thickness reporting.

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IEDM 2025

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Substrate Vision Summit 2025

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SEMICON West 2025

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