NOVASiC: Expert in reclaiming & wafering services for high-quality, wide-bandgap materials.
With over 25 years of experience, NOVASiC delivers specialized wafering and reclaim services for wide-bandgap semiconductor wafers.
This comprehensive offering enables NOVASiC to support diverse projects, from industrial-scale applications to precise, small-scale research initiatives.
Up to 10 times
A minimum of 10µm is removed in addition to the epitaxial layer, in function of the initial epitaxy thickness and the quality of the thickness reporting.
SEMICON West 2025
ECOC 2025
ICSCRM 2025
Soitec's technological innovation is focused on providing engineered substrates and advanced materials solutions that will drive the future of energy-efficient electronics