Smart Cut, Soitec’s proprietary wafer-bonding and layer-splitting technology makes it possible to transfer a thin layer of crystalline material from a donor substrate to another substrate, overcoming physical limitations and changing the face of the substrate industry.
Most of today’s industry-leading SOI wafers destined for chip manufacturing are made by wafer suppliers using Smart Cut technology. This technology also is behind the development of new families of standard and custom engineered wafers.
Smart Cut technology was developed in collaboration with CEA-Leti, one of the world’s premier microelectronics research laboratories. The technology was particularly made viable for high-volume commercial production by Soitec, and is now protected by more than 3,000 Soitec-owned or controlled patents.
Smart Cut technology makes use of both implantation of light ions and wafer bonding to define and transfer ultra-thin single-crystal layers from one substrate to another. It works like an atomic scalpel and allows active layers to be managed independently from the supporting mechanical substrate.
In combination with other substrate materials and technologies in the Soitec portfolio, Smart Cut enables any thin film materials to be transferred on top of any other materials while maintaining initial crystallographic properties.
This technologies toolbox also provides the electronics industry with new opportunities for innovation and differentiation in growing and emerging fields including sensors (image sensing, MEMS pressure sensors, etc.), flexibles electronics, wearables, 3D applications, new materials (high-mobility, carbon nanotubes, graphene) for advanced processing, wireless communication (5G, narrow band, LiFi), thin-film batteries, energy harvesting, LEDs, display panels and solar cells, etc.