SMART CUT™ TECHNOLOGY, SMART CHOICE

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SMART CUT WITH SOITEC'S PROPRIETARY TECHNOLOGY

A recognized  industry standard

Smart Cut, Soitec’s proprietary wafer-bonding and layer-splitting technology makes it possible to transfer a thin layer of crystalline material from a donor substrate to another substrate, overcoming physical limitations and changing the face of the substrate industry.

Most of today’s industry-leading SOI wafers destined for chip manufacturing are made by wafer suppliers using Smart Cut technology. This technology also is behind the development of new families of standard and custom engineered wafers.

DEVELOPED AND INDUSTRIALIZED BY SOITEC FOR HIGH-VOLUME PRODUCTION

Smart Cut technology was developed in collaboration with CEA-Leti, one of the world’s premier microelectronics research laboratories. The technology was particularly made viable for high-volume commercial production by Soitec, and is now protected by more than 3,000 Soitec-owned or controlled patents.

Soitec_SmartCut-Technology

WORKS LIKE AN ATOMIC SCALPEL

Smart Cut technology makes use of both implantation of light ions and wafer bonding to define and transfer ultra-thin single-crystal layers from one substrate to another. It works like an atomic scalpel and allows active layers to be managed independently from the supporting mechanical substrate.

This combination of implantation and wafer bonding provides multiple advantages:
 

  • By implanting light elements, layers can be engineered with no defects on the transferred layer.
  • The thickness of the transferred layer can be determined with a high degree of precision by adjusting the implantation energy.
  • Thickness uniformity is guaranteed by fine-tuning control of the implanted species over the entire wafer surface.
  • Wafer bonding is suitable for multiple materials and a wide range of temperatures, opening the door to innovative alternatives when thermal expansion prohibits deposition.
  • The donor substrate can be reused many times; after each layer transfer operation, the surface is refreshed and the substrate can be used again.

Learn more about Smart Cut technology 

USED IN SEVERAL MANUFACTURING SITES FOR HIGH-VOLUME PRODUCTION

Smart Cut offers a slate of proven industrial advantages:

  • It is based on standard semiconductor-processing tools and can be scaled to multiple wafer diameters.
  • The range of possible thicknesses of the top silicon and buried oxide layers offers substantial flexibility.
  • The extremely high quality in terms of uniformity, bonding interfaces, and control of thickness variability is unmatched by any other process.

ENDLESS OPPORTUNITIES FOR INNOVATION

In combination with other substrate materials and technologies in the Soitec portfolio, Smart Cut enables any thin film materials to be transferred on top of any other materials while maintaining initial crystallographic properties.

This technologies toolbox also provides the electronics industry with new opportunities for innovation and differentiation in growing and emerging fields including sensors (image sensing, MEMS pressure sensors, etc.), flexibles electronics, wearables, 3D applications, new materials (high-mobility, carbon nanotubes, graphene) for advanced processing, wireless communication (5G, narrow band, LiFi), thin-film batteries, energy harvesting, LEDs, display panels and solar cells, etc.