CONNECT RF-SOI

SMARTPHONE FRONT-END MODULES

Our Radio Frequency Silicon-on-Insulator (RF-SOI) substrate technology equips smartphones and many other wireless devices with RF Front-End modules with outstanding performance enabling efficient, robust and reliable 5G and Wi-Fi connectivity.

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MODERN APPLICATIONS DEMAND HIGHER NETWORK DATA THROUGHPUT AND CAPACITY

Over the years, we have moved from simple text messages to live video transmission over our smartphones.

CELLULAR COMMUNICATION EVOLUTION

Since its introduction 5G has ensured top user quality of experience. Upcoming 5G-Advanced and 6G on long term promises to leverage in its strong foundations to deliver a higher level of connectivity thanks to the introduction of new frequency spectrum both in sub-10GHz and mmWave frequencies, more flexibility in resources assignment for more IoT use cases, non-terrestrial networks and many others

FRONT-END MODULES IN SMARTPHONES

Carrying your data at very high frequency

Smartphones integrate very diverse functions including radio emission and reception, digital processing, memory, audio, battery management, camera and display.
The RF front-end enables radio frequency signal transmission and reception between a cellular phone and the network infrastructure supporting its operation.

INCREASING COMPLEXITY

Each generation requires more devices and higher performance in the front-end module.
Because RF-SOI can bring better linearity and insertion loss at the best cost/performance trade-off, it enables higher data speeds, longer battery life and fewer dropped calls.

100%

of 5G smartphones embed Soitec RF-SOI substrates

CONNECT RF-SOI PRODUCTS

Our RF-SOI substrates set the industry standard.

Soitec RF-SOI products are manufactured in our different world sites ensuring supply robustness. They deliver performance and value helping the industry achieve targeted total cost of ownership.

Our substrates expand planar CMOS RF capabilities to performance levels needed for the most demanding wireless applications. They provide an excellent base on which to deliver high linearity, high crosstalk isolation, low RF signal loss, co-integration of RF, digital, power management and other functionalities.

Our product portfolio offers the right solution to all RF front-end performance requirements.

Connect RFeSI™

For the best in industry RF harmonics suppression and noise isolation.

The RFeSI™ family of products is used worldwide to manufacture a large range of RFFE modules used in several generations of cellular (4G LTE, 5G, 5G NTN, 5G-A, etc), Wi-Fi, Bluetooth, Ultra-Wide Band and other wireless systems.

Each one of the RFeSI™ substrate component layers is tailored to deliver on the most demanding needs of wireless products and applications.

RFeSI™ signature Trap-Rich layer is continuously refined to enable industry-leading RF performances.

Connect iFEM-SOI

For cost sensitive highly integrated devices.

Our iFEM-SOI substrate is particularly well suited to Wi-Fi, IoT and other consumer applications specifications.

A simplified Trap Rich layer allows for a trade-off between performances and RFIC total cost of ownership.

Connect HR-SOI

For enhanced RF CMOS performance.

Soitec HR-SOI is used to manufacture RFICs that as discrete blocks complement the work of RFFE modules built on RFeSI™.

Without a Trap-Rich layer, Soitec HR-SOI is used in high-volume cellular 2G and 3G and IEEE 802.11n (Wi-Fi 4) systems with low complexity RF signals less prone to RF noise interferers.