Developed in collaboration with CEA-Leti (one of the world's top microelectronics research labs), the Smart Cut technology may be described as an "atomic scalpel", used to transfer a very thin layer of material from one substrate to another.
This technology enables us to stack extremely thin (10 to 100 nm) and perfectly uniform crystalline layers of semiconductors, which could not be achieved using classic microelectronic technologies.
We are now the world leader in silicon-on-insulator (SOI).
By using and perfecting the Smart Cut technology, we industrialized the production of silicon-on-insulator (SOI), a material used by our clients to manufacture more high-performance and energy-efficient electronic components.
We have also extended use of the Smart Cut technology to materials other than silicon, and developed other layer transfer technologies (e.g. Smart Stacking) and other types of expertise, such as epitaxy.
As a world leader in production of SOI, specialized substrates and industrial fine-layer transfer technologies, we invest an average of 10% of our total annual sales in R&D and we have a portfolio of over 3,000 patents.
We develop synergies to remain at the forefront of R&D efforts on semiconductor materials and technologies that support society's digital transformation (the Internet of Things, connected cars, smart cities, etc.).
Our collaborations with prestigious universities, renowned labs and major industrial players enable us to anticipate the needs of new markets and the characteristics required for future generations of electronic components.
We also take full advantage of our technological and industrial environment: Grenoble, where our main site is located, is a major European center for microelectronics and is home to leaders in research, higher education and industry.
Backing from French and European public authorities helps drive our innovation strategy.
The NanoSmart program, backed by OSEO (a French public investment company), has enabled us to develop disruptive substrates that we now sell in new sectors (e.g. radio-frequency), to strengthen our R&D partnerships, to invest and to create jobs.
We have committed to Investments for the Future (a French government investment program) projects involving substrates for microelectronics or energy (digital projects or projects backed by the ADEME, the French Environment and Energy Management Agency).