Market-changing innovation has always been the pathway to success at Soitec, beginning with
our initial breakthrough – Smart Cut™ technology – extending through Smart Stacking™ and
our compound semiconductor and high-mobility materials epitaxy expertises. Our technology toolbox enables us to produce engineered substrates, consisting of multi-layer materials, by transferring any thin film materials on the top of any other materials while maintaining the initial crystallographic properties.
Our engineered substrates enable Soitec to address the performance, energy-efficiency and cost-efficiency requirements of electronics devices.