Bernin (Grenoble), France, March 4th, 2020 – Soitec (Euronext Paris), a world leader in designing and manufacturing innovative semiconductor materials, today announced the availability on its website of a new presentation focused on engineered substrates for 5G markets and applications.
Paul Boudre, Soitec’s CEO, commented: “Since the beginning of 5G, Soitec has been working on its development with the RF ecosystem. Today, with 5G’s ongoing global deployment, we are willing to share our vision with our day-to-day partners. Soitec is answering current and future customers' needs through a comprehensive portfolio of engineered substrates that is geared to support their growth. On the ground of proven and differentiated technologies such as RF-SOI (which has become a standard for smartphones' front-end modules), Soitec will benefit from the anticipated footprint expansion of FD-SOI, Piezo-on-insulator (POI), Gallium Nitride (GaN) and Silicon Photonics within smartphones and base stations.”
The presentation referred to is available from the investors section of Soitec’s website:
Fourth quarter FY’20 sales are due to be published on April 22nd, 2020 after market close.
Soitec (Euronext, Tech 40 Paris) is a world leader in designing and manufacturing innovative semiconductor materials. The company uses its unique technologies and semiconductor expertise to serve the electronics markets. With more than 3,500 patents worldwide, Soitec’s strategy is based on disruptive innovation to answer its customers’ needs for high performance, energy efficiency and cost competitiveness. Soitec has manufacturing facilities, R&D centers and offices in Europe, the U.S. and Asia.
Soitec and Smart Cut are registered trademarks of Soitec.
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