Maker Faire Tokyo 2018: discover Sony SPRESENSE™, a Low-Power, Smart-Sensing Processor-Equipped Board for IoT.
Soitec spotlight in Global Semiconductor Alliance (GSA) Forum - FD-SOI: A technology setting new standards for IoT, automotive and mobile connectivity applications.
Soitec reports FY’19 first quarter revenues.
The letter to shareholders of July 2018 is now available.
Ordinary and extraordinary shareholders’ general meeting of July 26, 2018
Availability of the supporting documents.
Leti and Soitec Launch a new substrate innovation center to develop engineered substrate solutions.