Soitec Publication1
April 14, 2016
RFeSI product characterization 300mm

This paper describes how Soitec‘s innovative metrology on its wafers is able to predict the RF performance of final devices manufactured on Soitec RFeSITM substrates.

Soitec Publication2
November 3, 2013
Innovative RF-SOI Wafers for Wireless Applications

This paper explains the value of using RF-SOI substrates and what the latest generation of Soitec Wave SOI™ (Soitec eSI™) brings to RF IC performance while simplifying the IC manufacturing process in order to address the mainstream smart phone market.

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August 1, 2012
Innovative wafers for energy-efficient CMOS technology

For continued attractiveness and competitiveness of advanced electronic appliances such as smartphones, TVs, notebooks or tablets, the semiconductor industry is moving to “fully depleted” transistor technology to build integrated circuits.

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February 5, 2012
Planar fully depleted silicon technology to design competitive SOC at 28nm and beyond

This document considers the challenges to obtain competitive silicon technology for the upcoming generation of System-On-Chip ICs. It suggests planar fully depleted technology deserves serious interest.