Smart Stacking™

Smart Stacking™ is a wafer-to-wafer stacking technology platform of partially or fully processed wafers. This technology enables transferring of very thin layers in a high volume production environment. The core technologies are low temperature molecular oxide-oxide bonding, surface conditioning and wafer thinning.

This technology is adapted for advanced semiconductor applications such as Back-Side Illumination (BSI) image sensors as well as via last 3D integration approaches. The technology platform scales from 150 to 300mm wafer diameter and is compatible with various wafer types (Si, Glass, Fused silica, poly SiC, etc.).

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