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SOI for radio frequency (RF) applications
Soitec Wave SOI™ product line has been developed to enable the integration of radio frequency functions like power amps, antenna switches, and transceivers, as well as digital processing and power management—all on the same die. We supply standard and customer-specific structures on high-resistivity (HR) base wafers.
Our Soitec Wave SOI products for radio frequency (RF) applications are designed and manufactured using Soitec’s mature Smart Cut™ technology. We also draw on many years of experience producing SOI wafers in high volume runs.
Soitec Wave SOI products for RF applications are perfect for manufacturing high-performance, highly-integrated RF Front-end Module and System-on-Chip (SoC) devices.
Soitec Wave SOI RF product line
- 2G/3G specification-compatible
- 70nm to 1µm top silicon layer produced using Smart Cut technology
- 145nm to 2µm buried oxide layer
- Uniformity control +/- 125Å for thin film
- Base wafer resistivity > 1kohm.cm
Benefits
- HR-SOI: High performance on silicon film, compatible with standard CMOS processes
- Low RF loss
- High RF isolation
- High linearity
- High power signal
- Integrates digital processing and power management