Soitec appoints Paul Boudre to the newly created position of executive vice president of sales, marketing and customer support
Former KLA-Tencor executive chartered with bolstering company’s business and growth strategy.
BERNIN, France, February 1, 2007 - Soitec (Euronext Paris), the world’s leading manufacturer of silicon-on-insulator (SOI) wafers and other engineered substrates, today announced it has appointed former KLA-Tencor executive, Paul Boudre, to the newly created post of executive vice president of sales, marketing and customer support. As a core member of the office of the president, Boudre will report directly to André-Jacques Auberton-Hervé, Soitec’s president and chief executive officer.
In his newly created role, Boudre will lead the company’s worldwide sales and marketing efforts, the expansion into new markets and identifying new applications to achieve the company’s revenue growth objectives; and ensure that customers continue to receive the award-winning service and support they have come to expect from Soitec.
Commenting on today’s announcement, Auberton-Hervé noted, “The appointment of Paul to oversee these vital roles is a noteworthy step forward for Soitec. His demonstrated track record and leadership skills will prove critical in helping us leverage our existing resources along with focus our efforts on the expansion opportunities available in our markets—especially as SOI and other engineered substrates become increasingly paramount to extending Moore’s law. Moreover, Paul’s solid understanding of this market, and the close ties he established with leading chipmakers while at KLA-Tencor, makes him ideally suited for this role.”
A semiconductor industry veteran of more than 20 years, Boudre possesses a broad range of experience across strategic planning, marketing, sales, operations and engineering in the semiconductor industry. Most recently, he held at KLA Tencor the position of vice president and general manager for U.S. and Europe field operations, as well as vice president of the yield management group and field applications worldwide.
Previously, Boudre held management positions with IBM, STMicroelectronics, Motorola and Atmel. He holds a master’s degree in chemistry from France’s Ecole Nationale Superieure de Chimie de Toulouse.
About The Soitec Group
The Soitec Group is the world’s leading innovator and provider of the engineered substrates that serve as the foundation for today’s most advanced electronic products and nanotechnologies. Headquartered in Bernin, France, the company manufactures its comprehensive portfolio of engineered substrates, including silicon-on-insulator (SOI) and strained SOI (sSOI), using Soitec’s proprietary Smart Cut™ technology— the de facto industry standard. With its strong global presence, patented technology and industry-leading production capacity, Soitec is helping to drive the performance and power advantages that are key to the smaller, more power efficient, and increasingly mobile electronic products favored by consumers worldwide. Both shares and convertible bonds are listed on Euronext Paris. For more information, visit the company's website located at www.soitec.com.
Soitec, Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On Insulator Technologies
Company Contact:
Camille Darnaud-Dufour
Vice President, Communications
The Soitec Group
Mobile (France): +33-6-79-49-51-43
camille.darnaud-dufour@soitec.com
Agency Contact:
Kelly Picasso
Senior Account Associate
MCA
Tel: +1-650-968-8900, ext. 127
kpicasso@mcapr.com