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Target markets: Automotive and transportation; power management; industrial and control systems; military and aerospace; lighting; and healthcare
With applications ranging from cars to medical equipment, electronic components are now pervasive across virtually all industries. Chip designers are seeking better integrated and higher performance solutions for these applications. Soitec products address the demand for high reliability, high voltage operation, and integration of digital and power functions that are required by these applications.
The best engineered substrates and circuit layer solutions for integrated, reliable, low–power, high-performance electronic devices.
Soitec products are used in a wide range of applications, providing significant benefits:
- Better isolation
- Reduced die size
- Improved reliability
- High-temperature operation
- Lower power consumption
- Higher performance
We provide a “first time right” design for increased efficiency and robustness.
|
Market |
Applications |
Functions |
|---|---|---|
|
Automotive
|
Powertrain control Body electronics Control and safety Battery management Driver assistance |
Analog and power MEMS Image sensor |
|
Industrial Testing Measurement |
Motor control Lighting Processing Imaging High temperature |
Analog and power Lighting control Digital Image sensor |
|
Aerospace Military
|
Radiation hardening Processing High temperatures |
Analog and power Digital |
|
Medical
|
Processing Imaging Sensors |
Digital Image sensor MEMS |
We offer a full range of products to meet your needs:
|
Functions |
Requirements |
Soitec products |
Value proposition |
|---|---|---|---|
|
Analog/Power |
Reduce system footprint by integrating more functions (higher voltage or higher temperature) Lower power consumption |
High voltage and high power support Operate at much higher temperatures Integration capability of different device types |
|
|
Lighting control |
Ignite and reach full brightness faster Extend lifetime Improve color rendering |
Integration of controller and power functions Increased lamp lifetime Stability at high operating temperatures Dimming capability |
|
|
Image sensors |
Improve sensitivity in low light Increase number of pixels Maintain small die size |
Stacking for Imagers |
Faster learning and ramp-up Higher yield in volume production Lower total cost of ownership |
|
MEMS |
Facilitate integration into standard CMOS Improve scalability, reproducibility, and reliability in high-volume production environments |
MEMS SOI Stacking for MEMS |
New design freedom Integration with CMOS process Improved electrical performance Improved yield Reduced cost |
|
Digital |
Reduce system footprint & increase number of functions Lower power consumption & increase system performance Provide immunity to radiation |
Withstands extreme environments Significant increase in performance at identical power consumption Much lower power consumption at identical performance Better integration of new features |