Mobile and consumer market applications
To stay ahead of the fast-paced mobile and consumer electronics markets, device developers and manufacturers must constantly strive to improve integration, energy-efficiency, and performance. To address environmental issues, today’s always-connected, go-anywhere consumer electronics must meet increasingly stringent energy-efficiency requirements. Soitec's substrate products and related technology help device developers and manufacturers respond to consumer demand for performance, long battery lifetimes for portable devices, and integration.
In mobile and consumer devices such as tablets, smartphones, digital cameras, flat panel displays, and gaming consoles, Soitec products are leveraged to provide key benefits.
|
Market |
Applications |
Functions |
|---|---|---|
|
Consumer electronics
|
Game consoles, PCs, TVs, Set top box processing Imaging |
Digital processing Analog and power MEMS Image sensor |
|
Mobile devices
|
Smartphones, tablets, and other mobile devices:
|
Digital Image sensor RF Analog and power |
Whatever challenges you are facing, Soitec can help you find effective solutions:
|
Functions |
Challenges |
Soitec products |
Value proposition |
|---|---|---|---|
|
Digital |
Reduce system footprint & increase number of features Lower power consumption & increase system performance |
|
Significantly increased performance in the same power envelope Much lower power consumption at the same performance level Better integration of new features |
|
RF |
Provide better support for multiple frequency spectrums Provide better integration for mobile devices Allow for extremely low power consumption |
Bonded Silicon-on-Sapphire (SOS) |
Integration of an increased number of features or standards Better performance Lower power consumption Optimal quality and performance |
|
Power/Analog |
Integrate high- and low-voltage features Improve reliability and prevent latch-up Reduce power consumption |
Good resistance to high voltages and high power Operate at much higher temperatures Integration of different device types |
|
|
Image sensors |
Improve sensitivity in low light Increase number of pixels Reduce die size Lower costs |
Stacking for Imagers |
Faster learning and ramp-up Higher yield in volume production environments Lower total cost of ownership Improved quantum efficiency and sensitivity |
|
MEMS |
Allow for standard CMOS integration Improve reliability, size, control, and precision Allow for scalability and reproducibility in high-volume production environments |
MEMS SOI Stacking for MEMS |
Much greater design freedom Integration with CMOS process Improved precision, control, reliability, and performance, even at extreme temperatures Improved yield, smaller package Reduced cost |